As has been discussed in this forum a number of times, due the unique construction of its PCB, the ADI-2 Pro R BE can get quite hot from operation, which is considered normal in most applications.

I have recently installed my unit, along with a Digiface AES, in a rack with a Unirack. As shown below, it is currently sandwiched between a PDU above and a 2-slot horizontal 500-series chassis below, all of which are occasionally (though not normally) on for 24+ hours:

Below that is 1U of empty space (with a wood blanking panel) to provide additional ventilation for the larger 500-series rack below. Of course, the back of the rack is open.

In this configuration, the face of the ADI-2 Pro R BE gets very hot to the touch, and I believe it is the principal source of heat for the units above and below.

My question: is it necessary to leave empty slots above and/or below the Unirack in this case? If so, would a 1/2-unit vented panel on either the top or the bottom be sufficient, or is it necessary to leave space on both the top and the bottom? And would 1U vs 1/2U make a difference?

I realize there may be no one-size-fits-all solution, but I am curious to hear from the experts here.