Topic: Heat dissipation - bus-powered / half-rack / full-size units
I wonder if there are some temperature measurements how much heat the interfaces / converters tend to dissipate, as it already was discussed a few timer over quite a long period of time, for example:
- UCX II https://forum.rme-audio.de/viewtopic.php?id=33701
- BabyFace https://www.forum.rme-audio.de/viewtopic.php?id=23328
- old MultiFace1 https://www.forum.rme-audio.de/viewtopic.php?id=14952
From my previous experience or expectations:
- original BabyFace: Typical power consumption: 3,6 Watt, absolutely not to be felt on the desk at all, gets a tiny bit warmer with P48 on
- QuadMic2: 6 W, nothing to be really felt
- ADI-2: 8 W, somewhat warmer, noticeable, but still fine
- MF2: 12 W, I could keep my teacup warm on top of it... for real
Sadly, I don't have any full-size current-gen unit (UFX II / III, 12Mic) at hand, but if the heat dissipation correlated with the wattage, then those get comparably hot or even hotter, as the above mentioned UCX II thread describes, but some say it gets better: "FF400 extremely hot vs UCX II not heating at all" https://forum.rme-audio.de/viewtopic.ph … 96#p180096
My uneducated guess is the heat-to-performance ratio tends to improve over hardware generations, as in CPUs, GPUs, etc. I'd think most of the heat comes from FPGAs.
Anyway, apart from using rubber feet / generous rack spacing, or active ventilation like fans, there isn't much to be done about it.
Am I correct?